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F-214
(2,00 mm) .0787"
MEZZ
HDAM –11–12.0 –S –13 –2
HDAF –11–08.0 –S –13 –2
HDAM, HDAF SERIES
RUGGED ELEVATED HIGH DENSITY ARRAY
HDAM Mates with:
HDAF
HDAF Mates with:
HDAM
NO. OF PINS
PER ROW
LEAD
STYLE
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
OTHER
OPTION
HDAM
SPECIFICATIONS
For complete speci?cations and
recommended PCB layouts see
www.samtec.com?HDAM or
www.samtec.com?HDAF
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
–11, –15, –23
Specify
LEAD
STYLE
from
chart
–S
= 30μ"
(0,76 μm)
Gold on
contact area,
Matte Tin
on tails and
guide pins
–13
–2
= Lead-Free
Tin Alloy
95.5% Sn/
3.8% Ag/0.7%
Cu
Solder Charge
–P
= Pick &
Place Pad
Plating:
Au or Sn over
(22,50) .886
A
A
–12.0
–17.0
50μ" (1,27 μm) Ni
Current Rating:
3.4 A per pin
(6 adjacent pins powered)
Operating Temp Range:
-55°C to +125°C
Contact Resistance: 19 m Ω
Working Voltage: 200 VAC
Mated Cycles: 100
RoHS Compliant: Yes
Lead-Free Solderable: Yes
RECOGNITIONS
For complete scope of
1A
(2,00)
.0787
1M
No. of
Pins
Per
Row
x
(2,00)
.0787
+
(16,06)
.632
No. of
Pins
Per
Row
x
(2,00)
.0787
+
(11,55)
.455
LEAD
STYLE
(14,41)
.567
(19,41)
.764
HDAM/HDAF
35 mm Stack Height
Single-Ended
Signaling
Differential Pair
Signaling
? Integrated guide
posts
Rated @ 3dB Insertion Loss*
9 GHz / 18 Gbps
9 GHz / 18 Gbps
recognitions see
*Data based on simulations using Final Inch ? design.
www.samtec.com/quality
(1,20)
.0472
(5,09) .200
*Performance data includes effects of a
non-optimized PCB.
Performance data for other stack heights and complete
test data available at www.samtec.com?HDAM,
DIFFERENTIAL
www.samtec.com?HDAF or contact sig@samtec.com
APPLICATIONS
(1,20)
.0472
HDAF
NO. OF PINS
PER ROW
LEAD
STYLE
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
OTHER
OPTION
(2,00)
.0787
PAIR
ARRAY COUNT*
11x13 44
15x13 60
23x13 92
–11, –15, –23
(22,50) .886
Specify
LEAD
STYLE
from
chart
–S
= 30μ"
(0,76 μm)
Gold on
contact area,
Matte Tin
on tails and
weld tabs
–13
–2
= Lead-Free
Tin Alloy
95.5% Sn/
3.8% Ag/
0.7% Cu
Solder Charge
–P
= Pick &
Place Pad
*2:1 S:G Ratio
No.
of
Pins
No.
ALSO AVAILABLE
(MOQ Required)
? Tin-Lead Solder Charge
Per
Row
x
(2,00)
.0787
+
of
Pins
Per
Row
x
(2,00)
? Other platings
Contact Samtec.
Note: HD Mezz is a trademark
of Molex Incorporated
Note: Some lengths, styles
and options are non-standard,
non-returnable.
1A
(2,00)
.0787
(11,55)
.455
1M
(1,20)
.0472
LEAD
STYLE
–08.0
–18.0
A
(10,51)
.414
(20,51)
.807
.0787
+
(17,92)
.706
A
? Integrated guide
posts
WWW.SAMTEC.COM
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